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Solder Preforms
SOLDER PREFORMS
Gold-based Solder Preforms
Reinforced Solder Preforms
Silver-based Solder Preforms
Indium-based Solder Preforms
Lead-free Solder Preforms
Tin-lead Solder Preforms
Flux-Coated Preforms
Lead-free Solder Preforms
Lead-free Solder Preforms-Bi58Sn42
Under the premise of strictly controlling the dimensional tolerance and ensuring the consistency of the solder volume, the minimum thickness is 0.01mm and the minimum processing size is 0.02*0.02mm
Peculiarity
·? Of all solders, gold-based solders have the greatest tensile strength
·? Melting point 280℃, high melting point can be compatible with subsequent reflux process
·? Good wettability, corrosion resistance, oxidation resistance
·? High strength, good stability, more reliable, good fatigue resistance
·? Excellent electrical, thermal and heat dissipation performance
·? Excellent thermal fatigue resistance
·? Lead-free, in accordance with the RoHS (" Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ") specifications
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| ? Description |
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? ? Au80Sn20, eutectic point temperature is 280℃. In order to meet the needs of different scenarios, various shapes and sizes of preformed solder can be made. Good thermal fatigue properties and high strength properties at high temperatures are suitable for applications where high temperature strength and thermal fatigue resistance are required. It is also used where high tensile strength and corrosion resistance are required, and the high melting point is compatible with subsequent reflux processes. ? The Au80Sn20 eutectic filler metal can be used for solder solder in package welding, avoiding the contamination and corrosion of semiconductor chips caused by the use of flux. It is mainly used in optoelectronic packaging, high-power electronic device circuit airtight packaging and chip packaging. ? |
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? Solder Composition & Properties |
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· Solder Composition
| Element | Wt% |
| Gold（Au） | Margin |
| Tin（Sn） | 20±0.5 |
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· Physical Property
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Product Name |
Melting Point / ° C Solid/Liquid phase |
Density g/cm3 |
Electrical Resistivity μΩ·m |
Thermal Conductivity W/m·K |
Thermal Expansion 10-6/℃? |
Tensile Strength Mpa |
| Au80Sn20 | 280 | 14.52 | 0.224 | 57 | 16 | 276 |
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Lead-Free Bi58Sn42 Filler metal
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